Instructor: Professor
Tae Hun Chung
Week
|
Class Description |
Homework |
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Week 1 |
Introduction to plasma
processing |
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Microelectronic
fabrication and plasma fundamentals |
|
|
Overview
of plasma processing in microelectronics fabrication
|
HW#1 |
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|
Gas discharge
fundamentals |
|
Week
2 |
Cross-sections of
electron impact processes |
|
|
Mobility, diffusion,
and magnetic field effect |
HW#2 (HW#1 due) |
|
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|
Plasma Gas-Phase
Kinetics |
|
Week 3 |
Atomic and Molecular
Spectra |
|
|
Gas-phase kinetics
|
HW#3 (HW#2 due) |
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Plasma generation
|
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Week 4 |
Desired
characteristics of advanced plasma tools |
|
|
Plasma generators
|
HW#3 due |
Week 5 |
High density plasma
reactors |
|
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First Exam
|
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Week 6 |
Optical measurements
|
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Surface kinetics and
Surface analytical measurements |
HW#4 |
|
Critical plasma
processes |
|
Week 7 |
Plasma enhanced and
sputter deposition |
|
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Plasma diagnostics
|
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Electrical
measurements I |
HW#5 (HW#4 due) |
Week 8 |
Electrical
measurements II |
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Plasma etching
|
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Week 9 |
Other plasma
processes |
HW#6 (HW#5 due) |
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Plasma modeling |
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Feature scale and
Atomic scale modeling |
|
Week 10 |
Reactor scale modeling
|
HW#6 due |
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Challenges for
next-generation plasma processing |
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Final |
Final Exam |
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